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Enplas ic test socket chip adapter fpq-128-0.4-01
This is for one new open boxed unit of Enplas IC Test Socket / Aging Block / Chip ADAPTER FPQ-128-0.4-01.
QFP (Plastic Quad Flat Package) is a square-shaped flat-type package technology, which realize the distance between the chip-pin small pin is very thin, generally large-scale or ultra large scale integrated circuits using this package, the pin few are generally above 100. The technology packages are easy to operate, high reliability; and its smaller form factor package, reducing the parasitic parameters, suitable for high-frequency applications; QFP package, the main suitable for SMT surface mount technology in the PCB to install wiring.
