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Lk-F9 hot air & ir heating bga rework station


LK-F9 Hot air & IR Heating BGA Rework Station
This station can repair the large circuit board such as mainboards of computer, game machine and communications equipment.
The machine can dry the circuit board.
The infrared and hot air dual heating is used for this machine
The lower part of this machine is the preheating station which is used for the preheating of the PCB boards to ensure that the PCB board is not deformed.
Dimensions: length 410mm width 400mm high 380mm
The area of preheating: 360mm*300mm.
Upper heating temperature is related to nozzle
nozzle 43 mm *43 mm , Upper heating temperature is 240
nozzle 37 mm *37 mm , Upper heating temperature is 230
nozzle 23 mm *23 mm , Upper heating temperature is 210
nozzle 28 mm *28 mm , Upper heating temperature is 220
nozzle 43 mm *43 mm , Upper heating temperature is 270
nozzle 37 mm *37 mm , Upper heating temperature is 260
nozzle 28 mm *28 mm , Upper heating temperature is 250
nozzle 23 mm *23 mm , Upper heating temperature is 240
Upper heating temperature: 280
3. The temperature sensor of LK-F6 has not directly contact with circuit board and it is designed to detect the air temperature around the circuit board, and the value that thermometer shows is not the actual temperature of the circuit board.



Lk-F9 hot air & ir heating bga rework station