EXCLUSIVE FORUM FOR MACHINE DISMANTLERS AND REPAIR PEOPLE > Hammond
> Self Propelled
> Kester 951 no clean liquid flux xbox 360 rrod PS3 ylod
Kester 951 no clean liquid flux xbox 360 rrod PS3 ylod
* Kester 951 Flux, Low Solid, No-Clean Flux
* 1.2 oz bottle plus 5ml pipette dropper
* Manufactured 11/30/2009. Shelf life good until 11/30/2010.
* A 1.2oz bottle for free Total of 3.6 oz
* An extra pipette dropper for each bottle including one for the free 1.2 oz bottle Total of 3 pipette droppers
* For every two 1.2 oz bottles bought ..Get a 1.2oz bottle and extra pipette dropper
* Other bottle sizes are available. Just CLICK HERE.
* Xbox 360 with reflow to fix the Red Ring of Death
* Playstation 3 with reflow to fix the Yellow Ring of Death
* Other BGA reflow / rework applications
* Improves soldering performance.
* Eliminates the need and expense of cleaning.
* Non-corrosive tack-free residues.
* No offensive odors are given off during soldering.
* There are no residues to interfere with electrical testing.
* Ideal for foam and spray application.
* No-clean fluxes provide good activity, are halogen-free and non-corrosive, and don't degrade surface insulation resistance.
Kester 951 is a halogen-free, non-rosin organic flux designed for wave soldering conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically NO RESIDUE left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing.
Kester 951 exhibits improved soldering performance to minimize solder bridges (shorts) and excessive solder defects. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical organic water-soluble fluxes.
Kester 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
No returns or refunds accepted
